Title:
ELECTRODE MATERIAL, SEMICONDUCTOR DEVICE AND MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP3866503
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide electrode material capable of improving mechanical and electrical connection reliability of a solder electrode, a semiconductor device and a mounting device.
SOLUTION: This electrode marital is formed by making intermetallic compound particles generated from composition element of Pb free solder be included in the Pb free solder. As the Pb free solder, Sn based Sn-Ag or the like is used. As the intermetallic compound particles Ag3Sn or the like is used. The electrode material is used as solder electrodes 16 of a semiconductor device 1.
Inventors:
Soichi Homma
Application Number:
JP2000317808A
Publication Date:
January 10, 2007
Filing Date:
October 18, 2000
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
B23K35/26; H01L21/60; H01L23/14; (IPC1-7): H01L21/60; B23K35/26; H01L23/14
Domestic Patent References:
| JP2000150574A | ||||
| JP9327790A | ||||
| JP9122967A | ||||
| JP740077A |
Attorney, Agent or Firm:
Hidekazu Miyoshi