Title:
ELECTROLESS NICKEL OR NICKEL ALLOY PLATING METHOD
Document Type and Number:
Japanese Patent JP2023008598
Kind Code:
A
Abstract:
To provide a plating method that promotes adsorption to a non-conductive substrate, imparts a nickel catalyst and applies electroless nickel plating in sequence, thereby achieving sufficient coatability of a nickel film.SOLUTION: An adsorption promoting step (a) is constituted by two stages of a primary treatment (a1) using a cationic surfactant and a secondary treatment (a2) using an anionic surfactant. For imparting a catalyst, a nickel catalyst core can be imparted efficiently to a substrate, thereby achieving the coatability of a nickel film onto the substrate.SELECTED DRAWING: None
Inventors:
SATO KAZUO
OKUNO YOSHIMASA
OKUNO YOSHIMASA
Application Number:
JP2021112277A
Publication Date:
January 19, 2023
Filing Date:
July 06, 2021
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD
International Classes:
C23C18/20; C23C18/36
Attorney, Agent or Firm:
Hironori Toyonaga