Title:
ELECTROLESS PALLADIUM-NICKEL BATH AND PLATING METHOD USING THE SAME AS WELL AS PLATED PRODUCTS OBTAINED BY THE METHOD
Document Type and Number:
Japanese Patent JP3437980
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a electroless palladium-nickel plating bath which does not contain phosphorus and can apply uniform plating to objects to be plated of fine shapes.
SOLUTION: The electroless palladium-nickel bath prepared by selecting and using amine and carboxylic acid or its derivative as a complexing agent in the electroless palladium-nickel bath containing hydrazine as a reducing agent, the plating method using the same and the plated products obtained by the method.
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Inventors:
Hideo Homma
Kenji Watanabe
Hideto Watanabe
Go Takagi
Takehiko Tashiro
Kenji Watanabe
Hideto Watanabe
Go Takagi
Takehiko Tashiro
Application Number:
JP2000108177A
Publication Date:
August 18, 2003
Filing Date:
April 10, 2000
Export Citation:
Assignee:
Kanto Gakuin University Surface Engineering Research Institute
Ebara-Udylite Co., Ltd.
Ebara-Udylite Co., Ltd.
International Classes:
C23C18/48; (IPC1-7): C23C18/48
Domestic Patent References:
| JP5214551A | ||||
| JP5301991A | ||||
| JP711448A | ||||
| JP883796A | ||||
| JP1168315A | ||||
| JP6324072A |
Attorney, Agent or Firm:
Nobuo Ono
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