To provide an electrolytic plating method which improves a film-forming speed.
The electrolytic plating method includes electrolytically plating an article to be plated by using a plating liquid 3 containing metal ions and metal particles 31 of a metal which is deposited on the surface of electronic parts 10. In the above step, the metal particles 31 migrate to the surface of the electronic parts 10 together with the metal ions, while being convolved by a flow of the metal ions which migrate onto the surface of the electronic parts 10 placed in the plating liquid 3; and deposit on the surface of the electronic parts 10 to form a film, while the metal ions are converted into metal atoms on the surface of the electronic parts 10 and deposit on the surface of the article to be plated. Thus, the film is formed by the metal ions and the metal particles 31, so that the film-forming speed is improved in comparison with the speed of forming the film from only the metal ions.
KONNO MASAHIKO
SHIBUYA KAZUHIRO
SATO DAIKI
SUGIYAMA TOMONORI
SASAKI SHINJI
| JPS5521543A | 1980-02-15 | |||
| JPS62151598A | 1987-07-06 | |||
| JP2004315966A | 2004-11-11 |
Shiro Terasaki
Hiroaki Aoki
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