Title:
電磁波シールドフィルム
Document Type and Number:
Japanese Patent JP7023836
Kind Code:
B2
Abstract:
This electromagnetic shielding film is provided with: a shielding layer 111 that is formed of an aluminum film; and a conductive adhesive layer 112. The conductive adhesive layer 112 contains a conductive filler that is composed of spike-like or filament-like nickel particles; and the nickel particles have a median diameter (D50) of from 5 μm to 30 μm (inclusive), a mode diameter of 3 μm to 50 μm (inclusive), and a cumulative distribution at the mode diameter of 35% or more.
Inventors:
Zenji Yanagi
Application Number:
JP2018507336A
Publication Date:
February 22, 2022
Filing Date:
March 21, 2017
Export Citation:
Assignee:
Tatsuta Electric Wire Co., Ltd.
International Classes:
H05K9/00; B32B15/01
Domestic Patent References:
| JP2014056967A | ||||
| JP2009299186A | ||||
| JP2012178469A | ||||
| JP5861790B1 | ||||
| JP2004263030A | ||||
| JP5222346A | ||||
| JP2009079127A |
Foreign References:
| WO2015076174A1 |
Attorney, Agent or Firm:
Maeda patent office
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