Title:
ELECTROMAGNETIC WAVE SHIELDING STRUCTURE AND ELECTROMAGNETIC SHIELDING METHOD
Document Type and Number:
Japanese Patent JP2001111283
Kind Code:
A
Abstract:
To provide an electromagnetic wave shielding structure and its manufacturing method by which the mass productivity can be kept and flexibility of design be realized.
In an electronic device, which is shielded for electromagnetic wave with two or more shield cases where an electromagnetic shielding layer is formed, the joint surfaces of the shielding cases are connected electrically by means of conductive member made of synthetic resin. In such a structure, at least one joint surface of the shield cases to be jointed is coated with a liquid conductive resin and it is cured to form a conductive member, and then it is pressed to the other joint surface of the shield case and fixed thereto, while being electrically conductive.
Inventors:
HORIKAWA FUMIHIRO
FUJIKAWA NAOKI
TANAKA ATSUTOSHI
FUJIKAWA NAOKI
TANAKA ATSUTOSHI
Application Number:
JP28759799A
Publication Date:
April 20, 2001
Filing Date:
October 08, 1999
Export Citation:
Assignee:
THREE BOND CO LTD
MIYOSHI ELECTRONICS CORP
MIYOSHI ELECTRONICS CORP
International Classes:
H05K9/00; (IPC1-7): H05K9/00