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Title:
ELECTRON BEAM VAPOR DEPOSITION SYSTEM, METHOD FOR DEPOSITING VAPOR DEPOSITED FILM ON THE SURFACE OF SUBSTRATE USING THE SYSTEM, PIERCE TYPE ELECTRON GUN, AND METHOD FOR MONITORING BEAM STATE OF PIERCE TYPE ELECTRON GUN
Document Type and Number:
Japanese Patent JP2007051326
Kind Code:
A
Abstract:

To provide an electron beam vapor deposition system capable of depositing a vapor deposited film on the surface of a substrate under excellent efficiency and stability by monitoring the state of an electron beam emitted from a pierce type electron gun in a real time without interrupting the production during the driving of the system and feeding-back the result for improving or maintaining the state of the electron beam to the proper one, to provide a method for depositing a vapor deposited film onto the surface of a substrate performed using the system, to provide a pierce type electron gun capable of monitoring the state of a beam, and to provide a method for monitoring the state of a beam in a pierce type electron gun.

In the electron beam vapor deposition system provided with a pierce type electron gun, sensors for catching electrons sprung from or result from electron beams are installed in the vicinities of beam paths, and electric current and/or voltage based on the electrons caught by the sensors is detected, thus the state of the beam is monitored.


Inventors:
IIJIMA EIICHI
UCHIDA KAZUYA
Application Number:
JP2005237009A
Publication Date:
March 01, 2007
Filing Date:
August 17, 2005
Export Citation:
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Assignee:
ULVAC CORP
International Classes:
C23C14/30; H01J37/04; H01J37/06
Domestic Patent References:
JP2003302499A2003-10-24
JPH038251A1991-01-16
JPH11335820A1999-12-07
JPH0336268A1991-02-15
JP2004014226A2004-01-15
JP2000156187A2000-06-06
JPH0297665A1990-04-10
JP2004315971A2004-11-11
Attorney, Agent or Firm:
Yoshihiro Shimizu
Shinichi Abe
Yuji Tsujida