Title:
ELECTRON SOURCE SUBSTRATE MANUFACTURING APPARATUS, ELECTRON SOURCE SUBSTRATE, AND IMAGE DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP3830459
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electron source substrate manufacturing apparatus which can stably manufacture a high-quality, accurate, and reliable electron source substrate having an electron emitter which is free from clogging during injection.
SOLUTION: The electron source substrate manufacturing apparatus injects droplets of a solution forming a conductive thin film 4 between element electrodes 2, 3 on a substrate 1 with a droplet injection head having a discharge port diameter of &phiv 25 μm or less, volatilizes a volatile component in a droplet pattern provided, and remains a solid component on the substrate 1 to form a group of surface conduction type electron emitters. The solution forming the conductive thin film 4 is a solution obtained by dispersing fine metal particles in liquid, and the fine metal particles have a size equal to or less than the surface coarse of a face forming a pattern. Assuming that the size of the fine metal particles is defined as Dp, and the discharge port diameter as Do, the equation 0.0001≤Dp/Do≤0.01 is established. Injection control is performed so that the thickness of the pattern is equal to or more than the surface coarse.
More Like This:
Inventors:
Takuro Sekiya
Application Number:
JP2003100247A
Publication Date:
October 04, 2006
Filing Date:
April 03, 2003
Export Citation:
Assignee:
株式会社リコー
International Classes:
H01J9/02; H01J1/316; H01J29/04; H01J31/12; (IPC1-7): H01J9/02; H01J1/316; H01J29/04; H01J31/12
Domestic Patent References:
| JP2001307622A | ||||
| JP2000211124A | ||||
| JP2002261437A | ||||
| JP2122318U |
Attorney, Agent or Firm:
Chieko Tateno
Previous Patent: SOUND INSULATING WALL
Next Patent: BORING DEVICE AND UNDERGROUND BOREHOLE DRILLING METHOD
Next Patent: BORING DEVICE AND UNDERGROUND BOREHOLE DRILLING METHOD