To provide an electronic apparatus which can rigidly connect a shield cover to a multilayer wiring board and which has excellent productivity.

The electronic apparatus is obtained by mounting electronic part elements 3 on the multilayer wiring board 1 in which a plurality of insulating layers 1a are laminated and ground wiring is interposed between these insulating layers 1a, coating the multilayer wiring board 1 with the electronic part elements 3, and placing the shield cover 2 made of a metal having sidewalls 2a on an outer periphery. In this electronic apparatus, a plurality of cutouts 4 are formed on at least the uppermost layer of the insulating layers 1a to expose the part of a ground wiring 5, junction leg portions 2b disposed at their lower ends in the forming regions of the cutouts 4 on the sidewalls 2a of the shield cover 2, and the junction leg portion 2b are electrically connected to the ground wiring 5 exposed in the forming regions of the cutouts 4 via conductive adhesives 6.