PURPOSE: To obtain an electronic component cooling device, which can be made a comparatively free design without using a fan conforming to a small-sized electronic equipment and is good in cooling efficiency, by a method wherein heat generated from an electronic component is dissipated and cooled on the basis of heat conduction using a heat conduction module and a heat conductive rubber sheet.

CONSTITUTION: If heat is generated from an electronic component 2, the heat is conducted to a flat part 6a of a heat conductive rubber sheet 6, is conducted in the interior of the sheet 6 to reach end parts 6b and thence the heat is conducted to a heat conductive flat plate 3. Moreover, one part of the heat conducted from the component 2 to the flat 6a of the sheet 6 further reaches a flat part 5b of a heat conduction module 5, is conducted in the interior of the module 5 and is conducted from end parts 5c to the flat plate 3. One part of the heat conducted to the flat plate 3 is naturally dissipated from it, one part of the heat is further conducted to an electronic equipment case body 1 and is dissipated from there. As a result, a cooling effect is increased compared to that in the case of a conventional air cooling type and a fan for cooling use is not needed.