Title:
中継基板を用いた電子部品固定方法、中継基板の製造方法および中継基板を備えた部品実装基板
Document Type and Number:
Japanese Patent JP4503309
Kind Code:
B2
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Inventors:
Takeshi Kobayashi
Eiji Moriyama
Nakamura Shoji
Eiji Moriyama
Nakamura Shoji
Application Number:
JP2004037347A
Publication Date:
July 14, 2010
Filing Date:
February 13, 2004
Export Citation:
Assignee:
Ricoh Microelectronics Co., Ltd.
International Classes:
H01R33/76; H05K3/36; H05K1/14; H05K3/18; H05K3/46
Domestic Patent References:
| JP2003031617A | ||||
| JP2001313365A | ||||
| JP2001237039A | ||||
| JP11086931A | ||||
| JP11016938A | ||||
| JP10041348A | ||||
| JP7240568A | ||||
| JP7058244A | ||||
| JP4038843A |
Attorney, Agent or Firm:
Toshi Kuroda