Title:
ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3942457
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that the surface mounting of a small-sized electronic component having an outside diameter of 1 mm or smaller with a conductive adhesive agent is not stable because the adhesive agent runs off the edge and its sufficient amount cannot be ensured.
SOLUTION: With respect to the electronic component, the electronic component body 9 fixed on a first conductive film 7 and a second conductive film 8 arranged in approximately the same plane with the first conductive film 7 are electrically connected, and the fixed side of the electronic component body including the periphery of the first and second conductive films 7 and 8 is covered with resin 11. In this case, conductive protrusions 13 are formed from the surface of the conductive films 7 and 8 exposed from the resin 11.
Inventors:
Goro Ikegami
Kyonobu Sugimoto
Kyonobu Sugimoto
Application Number:
JP2002050903A
Publication Date:
July 11, 2007
Filing Date:
February 27, 2002
Export Citation:
Assignee:
NEC Electronics Corporation
International Classes:
H01G4/252; H01L23/50; H01L21/52; H01L21/56; H01L23/051; H01L23/12; H01L23/40; H05K3/34; (IPC1-7): H01L21/52; H01G4/252
Domestic Patent References:
| JP5166884A | ||||
| JP5129473A | ||||
| JP5041180U |
Attorney, Agent or Firm:
Tatsuo Tokumaru
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