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Patent Searching and Data


Title:
ELECTRONIC COMPONENT AND ITS MOUNTING METHOD
Document Type and Number:
Japanese Patent JPH10308571
Kind Code:
A
Abstract:

To stably stand an electronic component by itself, at a free height on a circuit board by using simple structure.

A flat part 4b is formed on a part of a lead wire 4a of an LED 4. The flat part 4b is bent at a right angle twice, and a holding part 4d and an insertion part 4e are formed. The lead wire 4a is inserted in a fixing hole 3b of a circuit board 3, the holding part 4d is made to abut against the upper surface of the circuit board 3, and the insertion part 4e is forcibly inserted in the fixing hole 3b. Since the holding part 4d is in surface-contact with the circuit board 3, generation of lateral falling-down can be prevented, and the height of the LED 4 can be easily adjusted by adjusting the bending position.


Inventors:
OKU HIDENORI
Application Number:
JP11670697A
Publication Date:
November 17, 1998
Filing Date:
May 07, 1997
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H05K1/18; H01L23/48; H05K3/30; (IPC1-7): H05K1/18; H01L23/48
Attorney, Agent or Firm:
Takashi Honda