ELECTRONIC COMPONENT MANUFACTURING APPARATUS AND METHOD

Japanese Patent JP3717340

B2

PROBLEM TO BE SOLVED: To provide an electronic component manufacturing apparatus of a where even when the defectives of electronic components are generated, the generation of the defectives can be limited to a minimum.
SOLUTION: A film thickness measuring unit, which is used in an electronic component manufacturing apparatus and measures the thickness of a thin film is formed into a structure, where a sensor unit 10 with a branched optical fiber provided in its interior is fixed on a support pillar 10a provided in the interior of a film-forming unit. The optical fiber is laid around in the interior of the support pillar 10a. The unit 10 is mounted in a substrate 3, which is positioned in the vicinity of a gate valve 13 of the film-forming unit, in such a way as to perform light radiation, almost vertically to the substrate 3. The film thickness measuring unit performs measurement of the thickness of the thin film, immediately after the thin film is formed.

WO/2021/040277	APPARATUS AND METHOD FOR MEASURING THICKNESS OF UNIT CELL
WO/1995/020771	METHOD AND APPARATUS FOR REMOTE DETECTION AND THICKNESS MEASUREMENT OF SOLID OR LIQUID LAYER
JPH08271228	SAMPLE THICKNESS MEASUREMENT METHOD

Junichi Tanaka
Yasunobu Tagusa
Toru Tanikawa

JP21173799A

November 16, 2005

July 27, 1999

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Sharp Corporation

G01B11/06; H01L21/66; (IPC1-7): H01L21/66; G01B11/06

JP57157105A
JP11014312A
JP7294220A
JP10154693A
JP61165608A
JP6042923A
JP6201471A
JP10154221A
JP2000352505A
JP2000193424A
JP2000180359A

Kuro Fukami

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