ELECTRONIC COMPONENT MANUFACTURING METHOD

Title:

ELECTRONIC COMPONENT MANUFACTURING METHOD

Document Type and Number:

Japanese Patent JP2003115710

Kind Code:

A

Abstract:

To improve the unloaded Q-value and increase the capacitance so that neither crack nor gap, etc., occurs in a dielectric board, even if the number of electrodes laminated to be formed in a dielectric board increases, and characteristics can be stabilized to improve the production yield of electronic components such as laminated dielectric filters.

A ceramic paste 50 is formed on a fourth-eighth dielectric layers S4-S8 having electrode patterns Pt3-Pt12 on their respective first main planes, such that the paste 50 is formed on the entire first main plane of each of the fourth-eighth dielectric layers S4-S8 having the electrode patterns Pt3-Pt12 on their respective first main planes, except a part of the electrode patterns Pt3-Pt12.

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Inventors:

MIZUTANI YASUHIKO
HIRAI TAKAMI
SAKA HIRONOBU
MIZUNO KAZUYUKI

Application Number:

JP2001310319A

Publication Date:

April 18, 2003

Filing Date:

October 05, 2001

Export Citation:

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Assignee:

NGK INSULATORS LTD
SOSHIN ELECTRIC

International Classes:

H01P1/203; H01P1/205; H01P11/00; (IPC1-7): H01P11/00; H01P1/203; H01P1/205

Attorney, Agent or Firm:

Takehiro Chiba (1 outside)
Takehiro Chiba

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