ELECTRONIC COMPONENT MOUNTING ADHESIVE AGENT AND ELECTRONIC COMPONENT MOUNTING STRUCTURE

Japanese Patent JP3948289

B2

PROBLEM TO BE SOLVED: To provide an electronic component mounting adhesive agent and an electronic component mounting structure, which are capable of tentatively fixing an electronic component without deteriorating its solderability.
SOLUTION: In an electronic component mounting method wherein bumps 4 provided to an electronic component 3 are soldered to electrodes 2 provided on a board 1, an adhesive agent 6 containing a resin component as a main component, a hardening agent which contains a liquid anhydride to harden the resin component, and an additive containing water or an alcohol is applied near outside of the electrodes 2 of the board 1, and the electronic component 3 is tentatively fixed to the board 1 until a reflow process is carried out. Even if the adhesive agent 6 penetrates into a solder-bonded interface between an outer electrode 2* and the bump 4* by heating in a reflow process, an active function is given to the adhesive agent 6 by the liquid anhydride, so that the adhesive agent 6 does no harm the solderability, and a soldering operation can be well carried out.

JP2006083302	WATER-BASED ADHESIVE
JPS62227971	SOLID PLASTICIZER
WO/2012/173055	ACTIVE-ENERGY-RAY-CURABLE ADHESIVE COMPOSITION FOR PLASTIC FILM OR SHEET

Tadahiko Sakai
Seiichi Yoshinaga
Toshikazu Matsuo
Ken Maeda
Mitsuru Ozono

JP2002012535A

July 25, 2007

January 22, 2002

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Matsushita Electric Industrial Co., Ltd

C09J11/06; H05K3/34; C09J163/00; C09J201/00; H01L21/60; (IPC1-7): H05K3/34; C09J11/06; C09J201/00; H01L21/60; //C09J163/00

JP2187097A
JP2001298047A
JP3016147A

Fumio Iwahashi
Hiroki Naito
Daisuke Nagano

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