Title:
ELECTRONIC COMPONENT MOUNTING METHOD
Document Type and Number:
Japanese Patent JP3960076
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component mounting method which enables a reduction in junction defect of metallic junction between a connecting electrode of an electronic component and an electrode of a board.
SOLUTION: In an electronic component mounting method for mounting an electronic component by performing metallic junction for a metallic bump 6 of an electronic component 5 to an electrode 2 of a resin board 1, the metallic bump 6 is landed to the electrode 2 via reinforcing resin 4 supplied to the upper surface of the board 1, and the metallic bump 6 is subjected to metallic junction to the electrode 2 by ultrasonic wave junction and is subjected to temporary pressure bonding. Thereafter, in a thermal hardening process for thermally curing the reinforcing resin 4 by heating the resin board 1, it is heated by a temperature at not exceeding a glass transition temperature of a material of the resin board 1. Thereby, it is possible to reduce junction defects caused by the breakage of a metallic junction part by lowering thermal stress generated in the metallic junction part.
Inventors:
Makoto Okazaki
Shoji Sakami
Shoji Sakami
Application Number:
JP2002050975A
Publication Date:
August 15, 2007
Filing Date:
February 27, 2002
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H05K3/32; H01L21/56; (IPC1-7): H01L21/60; H01L21/56; H05K3/32
Domestic Patent References:
| JP2001127425A | ||||
| JP9266227A | ||||
| JP11340280A | ||||
| JP9082755A | ||||
| JP63151033A | ||||
| JP2001298146A | ||||
| JP2002043367A |
Foreign References:
| WO2002078079A1 |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano