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Patent Searching and Data


Title:
ELECTRONIC COMPONENT MOUNTING SYSTEM AND METHOD FOR MOUNTING ELECTRONIC COMPONENT ON PRINTED BOARD
Document Type and Number:
Japanese Patent JPH1051189
Kind Code:
A
Abstract:

To provide an electronic component mounting system which has a simple- structured component mounting device and which can mount electronic components rapidly, and also provide a method for mounting electronic components.

A printed board supporting device 12 is positioned and secured on a base 10, and a component supplying device 14 and a component mounting device 16 are installed on a Y-axis slide 254 on an X-axis slide 234 located on the base 10. A component mounting head is moved by a Y-axis rodless cylinder 296 between a component receiving position and a component mounting position to take out an electronic component from a cartridge 270 and mount it on a printed board 84. The X-asis and the Y-axis slide 234, 254 are moved by manual rotating operation of an X-axis feed screw and a Y-axis feed screw, to let the component mounting position agree with a component fixing position on the printed board 84. By the adjustment of the component mounting position and the linear reciprocating movement of the component mounting head (314) between the component receiving position and the component mounting position, the electronic component can be mounted at any component fixing position on the printed board 84.


Inventors:
ASAI KOUICHI
OKA TOSHIMITSU
Application Number:
JP20068496A
Publication Date:
February 20, 1998
Filing Date:
July 30, 1996
Export Citation:
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Assignee:
FUJI MACHINE MFG
FUJITA DENGIYOU KK
International Classes:
B23P21/00; H05K13/04; (IPC1-7): H05K13/04; B23P21/00
Attorney, Agent or Firm:
Norikazu Kobe (2 outside)