Title:
ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC MODULE
Document Type and Number:
Japanese Patent JP2017126647
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain an electronic component package which reduces a space in a solder layer forming a joint part between a seal ring and a circuit board to improve the solidness and thereby make leakage less likely to occur.SOLUTION: An electronic component package includes: a circuit board 10 having an electronic component mounting area on which a semiconductor chip is mounted, and a seal ring mounting area surrounding the electronic component mounting area; a seal ring 20 which is joined to the seal ring mounting area on its end surface by solder; and a cover member joined to the other end surface of the seal ring which faces the seal ring mounting area. The electronic component package houses the semiconductor chip. A joint surface of the seal ring 20 which is joined to the circuit board 10 includes an inclined surface 20A.SELECTED DRAWING: Figure 2
Inventors:
HASHIMOTO MINORU
Application Number:
JP2016004698A
Publication Date:
July 20, 2017
Filing Date:
January 13, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/10; H01L23/02; H01L23/08; H01L23/12; H01L23/13
Attorney, Agent or Firm:
Jun Takamura