Title:
ELECTRONIC COMPONENT UNIT AND FIXING STRUCTURE
Document Type and Number:
Japanese Patent JP2014165231
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component unit in which lowering of cooling efficiency of a semiconductor package, damage on the electrode, and the like, can be suppressed.SOLUTION: An electronic component unit includes a substrate, a semiconductor package mounted on the surface of the substrate, a heat sink having a pressing plate installed on the semiconductor package, a reinforcing plate arranged on the back of the substrate, and a plurality of fasteners for coupling the corners of the pressing plate and reinforcing plate mutually. The semiconductor package can be pressed against the substrate and fixed in place by fastening the fasteners. The reinforcing plate includes a base plate having a coupling part for coupling each fastener, and a pressing plate arranged on the plane center side of the base plate and laminated separably from the base plate to press the back of the substrate.
Inventors:
KOBAYASHI YOKO
SO TAKESHI
ITO NOBUTAKA
OUCHI YOSHITERU
NAKADA KATSUHIKO
SO TAKESHI
ITO NOBUTAKA
OUCHI YOSHITERU
NAKADA KATSUHIKO
Application Number:
JP2013032788A
Publication Date:
September 08, 2014
Filing Date:
February 22, 2013
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/40; H01L23/36
Domestic Patent References:
| JP2001060778A | 2001-03-06 |
Foreign References:
| US20080123311A1 | 2008-05-29 | |||
| US7477519B2 | 2009-01-13 | |||
| US20080009152A1 | 2008-01-10 | |||
| US6058014A | 2000-05-02 | |||
| US20060164807A1 | 2006-07-27 |
Attorney, Agent or Firm:
Hirakawa 明
Daisuke Takada
Daisuke Takada