ELECTRONIC COMPONENT AND ELECTRONIC UNIT

Title:

ELECTRONIC COMPONENT AND ELECTRONIC UNIT

Document Type and Number:

Japanese Patent JP2016033969

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide an electronic component capable of improving its reliability.SOLUTION: The electronic component includes: a metal portion; a mold resin covering at least a part of the metal portion; and a molecular adhesion layer which is formed between the surface of the metal portion and the mold resin.SELECTED DRAWING: Figure 2

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Inventors:

HAPPOYA AKIHIKO
SUZUKI DAIGO

Application Number:

JP2014156690A

Publication Date:

March 10, 2016

Filing Date:

July 31, 2014

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

H01L23/29; H01L23/12; H01L23/31; H01L33/00; H01L33/50; H01L33/54; H01L33/62; H05K3/28

Domestic Patent References:

JP2013201273A	2013-10-03
JP2006253398A	2006-09-21
JP2007134372A	2007-05-31

Foreign References:

WO2010052856A1

2010-05-14

Attorney, Agent or Firm:

Suzue International Patent Office

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