PURPOSE: To ensure a sealing, and to prevent the influence of a mechanical shock or the like from the outside, by a structure wherein an opaque resin layer with a high hardness to which a silicate filler is added is formed on a high insulating first layer with a flexibility.

CONSTITUTION: In an electronic component of a hybrid IC in which a resin coating is performed by means of a case potting method, a potting resin layer consists of a first layer 35 with which a circuit component received in a case 31 is covered, and a second layer 36 which is formed on the first layer 35 and closes the opening of the case 31. In this connection, the first layer 35 is made of a high insulating resin which does not contain substantially an additive of a colorant or the like, while the second layer 36 is made of a resin to which a silicate filler is added by the ratio of 10∼100% with respect to the weight of the resin and which has a low transparency and a higher hardness than that of the first layer 35. As a result, these is no possibility that after potting, a cap is putted on the case to close the opening, and therefore a space is formed between the cap and a potting resin and gas, water and the like enter the space from the outside to fill it. Moreover, since there is not a cap covering process, the manufacturing cost can be lowered.