Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH06215825
Kind Code:
A
Abstract:

PURPOSE: To provide heat resistance and an excellent solder reflow property by applying the surface mounting system coating the surface of an electronic component made of nylon 46 resin with polyvinylidene chloride having the molecular weight in a specific range.

CONSTITUTION: The polyvinylidene chloride used for coating an electronic component made of nylon 46 resin is radically polymerized with vinylidene chloride, and the polyvinylidene chloride having the molecular weight of 1,000-100,000 is preferably used. When the polyvinylidene chloride is used to coat the electronic component made of nylon 46 resin, polyvinylidene chloride is emulsified in water or an organic solvent, the electronic component is coated with the emulsion, then the solution is dried and removed. A polyvinylidene chloride layer is formed on the surface of the electronic component after the coating process preferably to the thickness of 5-50μm. A manifestation quantity of a pigment or other compounding agents can be added to the nylon 46 resin as required.


Inventors:
HIRONAKA KATSUHIKO
NISHIJIMA KIYOAKI
Application Number:
JP662193A
Publication Date:
August 05, 1994
Filing Date:
January 19, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TEIJIN LTD
International Classes:
C08J7/04; C09D127/04; C09D127/06; H01R13/46; H01R43/02; H05K1/18; (IPC1-7): H01R13/46; C08J7/04; H05K1/18
Attorney, Agent or Firm:
Maeda Junhiro