Title:
電子部品およびその製造方法
Document Type and Number:
Japanese Patent JP4032116
Kind Code:
B2
Abstract:
A metal plating structure, characterized in that it comprises a metal plating film and, incorporated therein, a fine carbon fiber of a derivative thereof, wherein the fine carbon fiber represents a carbon fiber having a diameter of approximately 200 nm or less and an aspect ratio of approximately 10 or more; the metal plating structure, which further comprises a resin material incorporated therein; and a method for producing the metal plating structure. Examples of the derivative include substances prepared by subjecting the fine carbon fiber to various chemical modifications and by fluorinating the fine carbon fiber. The metal plating structure can be suitably used for incorporating a fine carbon fiber of a derivative thereof into a metal at an ordinary temperature.
Inventors:
Susumu Arai
Morinobu Endo
Morinobu Endo
Application Number:
JP2002320407A
Publication Date:
January 16, 2008
Filing Date:
November 01, 2002
Export Citation:
Assignee:
Shinshu University
International Classes:
C23C18/52; C25D7/00; C23C18/16; C23C18/34; C25D3/38; C25D15/02; H01J9/02; H01L23/373; H05K3/18
Domestic Patent References:
| JP2004076031A | ||||
| JP2002264097A | ||||
| JP4158932A | ||||
| JP11335859A | ||||
| JP10212598A | ||||
| JP11217694A | ||||
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| JP2001283716A | ||||
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| JP2001107295A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu