Title:
ELECTRONIC CONTROL DEVICE
Document Type and Number:
Japanese Patent JP2021027178
Kind Code:
A
Abstract:
To provide an electronic control unit that has high bonding reliability regardless of a component shape and can suppress thermal fatigue fracture and void fracture that becomes apparent in high temperature regions.SOLUTION: The electronic control unit includes a circuit board 6, electronic components 20, and a Junction portion 4 that joins the circuit board 6 and the electronic components 20 (leaded components 21, leadless components 22, BGA components 23, and insertion-mounted components 24). The junction portion 4 is mainly composed of Sn, and the total content ratio of Bi and Sb is 3% or more by weight, it does not contain In, and the Ag content ratio is 3 to 3.9% by weight. The Bi content of the junction portion is less than 2.5% by weight, and the grain size of an intermetallic compound formed at an interface between the electronic component and the junction portion is 2 μm or more.SELECTED DRAWING: Figure 1
Inventors:
IKEDA YASUSHI
YAMASHITA SHIRO
YAMASHITA SHIRO
Application Number:
JP2019144061A
Publication Date:
February 22, 2021
Filing Date:
August 05, 2019
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD
International Classes:
H05K3/34; B23K35/26; C22C13/02; H01L23/12
Domestic Patent References:
| JP2018171656A | 2018-11-08 | |||
| JP2010149185A | 2010-07-08 | |||
| JP2004031771A | 2004-01-29 |
Foreign References:
| WO2014097390A1 | 2014-06-26 | |||
| WO2016042884A1 | 2016-03-24 |
Attorney, Agent or Firm:
Patent Business Corporation Sunnext International Patent Office