Title:
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2013102015
Kind Code:
A
Abstract:
To obtain means which reduces an electronic device in size, in height and in cost.
The electronic device is provided with a first electronic element 20 and an insulating substrate 11 which mounts the first electronic element 20 thereto. The insulating substrate 11 is provided with mounting terminals 13 on other principal surface while having electrode pads 12 which mount the first electronic element 20 thereto on one principal surface. Terminals provided on the first electronic element 20 and the electrode pads 12 are conductively connected to one another via connecting conductive members 15.
Inventors:
SUGANO HIDEYUKI
Application Number:
JP2011244215A
Publication Date:
May 23, 2013
Filing Date:
November 08, 2011
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L23/12; H01L21/60; H03B5/32; H03H9/02; H03H9/10
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka
Osamu Suzawa
Kazuhiko Miyasaka