Title:
ELECTRONIC DEVICE, ITS MANUFACTURING METHOD, AND ITS MANUFACTURING EQUIPMENT
Document Type and Number:
Japanese Patent JP3901427
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To offer an electronic device such as a semiconductor device, its manufacturing method, and its manufacturing equipment, which can avoid cracks and fractures in a ceramic substrate, by eliminating distorting power through buffering the pressure even when the ceramic substrate is sandwiched between top and bottom molds and is pressed.
SOLUTION: A ceramic substrate 32, at least one side (selected from front side and rear side) of which is integrated with a thin metallic film 2, is positioned inside and outside a cavity 38 of transfer molds so that the thin metallic film 2 is at positions where the top mold 30 and bottom mold 31 come into contact with each other.
Inventors:
Ken Kobayashi
Takashi Araki
Takashi Araki
Application Number:
JP2000139072A
Publication Date:
April 04, 2007
Filing Date:
May 11, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/56; H01L23/28; H01L23/12; H01L23/13; H01L23/31; H01L23/498; (IPC1-7): H01L21/56; H01L23/13; H01L23/28
Domestic Patent References:
| JP10335529A | ||||
| JP8316362A | ||||
| JP62112333A | ||||
| JP11102924A | ||||
| JP8236560A | ||||
| JP10178270A |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners
Previous Patent: CONNECTING STRUCTURE OF INSULATION ELECTRIC WIRE
Next Patent: VENTILATION APPARATUS FOR KITCHEN APPARATUS
Next Patent: VENTILATION APPARATUS FOR KITCHEN APPARATUS