Title:
ELECTRONIC DEVICE, METHOD FOR SEALING THE SAME AND METHOD FOR CONNECTING THE SAME
Document Type and Number:
Japanese Patent JP3875077
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent deterioration between connected terminals or between connected wires and terminal in an electronic device such as a semiconductor device having external terminals, or a wiring substrate.
SOLUTION: A sealing insulation film 9 and an external terminal 7 are included. The sealing insulation film 9 is formed on a substrate 1 and has fluidity by fusing at a first heating temperature. The external terminal 7 is formed on the substrate 7, and is connected to the other electronic devices 11 at a second heating temperature higher than the first heating temperature, and is enclosed with the sealing insulating film 9 surrounding the external terminal 7.
Inventors:
Yoshitaka Aiba
Hirohisa Matsuki
Mitsutaka Sato
Hirohisa Matsuki
Mitsutaka Sato
Application Number:
JP2001351501A
Publication Date:
January 31, 2007
Filing Date:
November 16, 2001
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/60; H01L21/56; H01L23/28; H01L23/29; H01L23/31; H01L23/485; H05K3/28; H05K3/32; H05K3/34; (IPC1-7): H01L21/56; H01L21/60; H01L23/29; H01L23/31; H05K3/28; H05K3/32
Domestic Patent References:
| JP11097467A | ||||
| JP6104311A | ||||
| JP2000228412A |
Attorney, Agent or Firm:
Keizo Okamoto