Title:
Electronic device
Document Type and Number:
Japanese Patent JP6198068
Kind Code:
B2
Abstract:
An electronic device includes a semiconductor module, a wiring substrate, a case member and a heat conducting member. The heat conducting member thermally connects predetermined portions of wiring patterns and a heat conducting pattern of the wiring substrate to a predetermined heat conduction region of a surface of the case member opposing to the wiring substrate. The predetermined heat conduction region is located further from the wiring substrate than a surface of a body portion opposing to the case member. As a result, heat can be radiated and a short can be restricted with the case member having a simple shape. The heat conducting pattern is disposed adjacent to at least one of non-terminal projecting surfaces of the body portion on a surface of the wiring substrate. As a result, an area of a heat conducting passage increases and heat radiation performance can be increased.
Inventors:
Seiji Morino
Application Number:
JP2014234449A
Publication Date:
September 20, 2017
Filing Date:
November 19, 2014
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/36; H05K7/20
Domestic Patent References:
| JP5047968A | ||||
| JP2010103368A | ||||
| JP2010206073A | ||||
| JP10233473A | ||||
| JP2013254810A | ||||
| JP2012079741A |
Foreign References:
| US20140238729 |
Attorney, Agent or Firm:
Patent business corporation Kyoritsu