電子デバイス、電子機器および移動体

Title:

電子デバイス、電子機器および移動体

Document Type and Number:

Japanese Patent JP7283613

Kind Code:

B2

Abstract:

To provide a method for manufacturing an electronic device with which the electronic device that can reduce its size while maintaining a necessary bonding strength between a substrate and a lid can be simply and appropriately manufactured, an electronic device, an electronic apparatus, and a movable body.SOLUTION: A method for manufacturing an electronic device includes steps of: forming a structure that is surrounded by a joint material in plan view and has a plurality of storage parts storing at least one functional element; and cutting the structure between the adjacent two storage parts into individual pieces in plan view. In the step of forming the structure, in the plan view, the joint material has a first portion that overlaps a wiring group and is located between a terminal group and the storage parts, and an intermediate part that is located between the adjacent two storage parts. In the step of cutting the structure into individual pieces, in the plan view, the intermediate part is cut along with the cutting of the structure to form second portions having smaller width than that of the first portion.SELECTED DRAWING: Figure 1

Inventors:

Teruo Takizawa

Application Number:

JP2022077998A

Publication Date:

May 30, 2023

Filing Date:

May 11, 2022

Export Citation:

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