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Title:
電子デバイス及びその製造方法
Document Type and Number:
Japanese Patent JP7059983
Kind Code:
B2
Abstract:
The present invention is a method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: providing a first wafer having solar cell structures on a starting substrate and a second wafer having drive circuits formed, so that either one of the first wafer or the second wafer has a plurality of independent diode circuits and capacitor-function laminated portions; obtaining a bonded wafer by bonding so that the solar cell structures, the diode circuits, the capacitor-function laminated portions, and the drive circuits are superimposed; wiring; and dicing the bonded wafer. This provides: a method for producing an electronic device including a drive circuit, a solar cell structure, and a capacitor-function portion in one chip and having a suppressed production cost; and such an electronic device.

Inventors:
Junya Ishizaki
Application Number:
JP2019110674A
Publication Date:
April 26, 2022
Filing Date:
June 13, 2019
Export Citation:
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Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L31/18; H01L21/02; H01L31/0443
Domestic Patent References:
JP2002517098A
JP2018148074A
JP2009229975A
JP2004140122A
JP59217991A
JP2005228944A
Foreign References:
WO2013042525A1
CN104124312A
KR1020110027274A
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi



 
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