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Patent Searching and Data


Title:
ELECTRONIC EQUIPMENT HOUSING STRUCTURE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH08263172
Kind Code:
A
Abstract:

PURPOSE: To give high shield effects with stable reliability and to swell part of a non-ferrous metal sheet with the injection pressure of resin and form a logotype, etc., in three dimensions by employing a resin molding means using a metal mold for solid molding that has a non-ferrous metal layer formed of a sheet type raw material integrally on at least part of the surface of a base body made of conductive resin.

CONSTITUTION: A rolled non-ferrous metal sheet 13 is supplied into metal molds 21a and 21b for solid molding and when the metal molds are closed, the sheet is punched in an outer peripheral shape which becomes necessary after molding. The non-ferrous metal sheet 13 which is punched in the metal molds 21a and 21b for solid molding is shaped in conformity with the recessed part shape of the metal molds in the metal molds 21a and 21b by injecting thermoplastic conductive resin 12 from an injection hole under high pressure. With the resin injection pressure at this time, a display of the logotype, etc., is formed in a projection shape.


Inventors:
KANBARA KATSUYUKI
Application Number:
JP6915995A
Publication Date:
October 11, 1996
Filing Date:
March 28, 1995
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B29C45/14; B29C45/16; B29C69/00; G06F1/16; (IPC1-7): G06F1/16; B29C45/14; B29C45/16; B29C69/00
Attorney, Agent or Firm:
Takehiko Suzue