Title:
ELECTRONIC MATERIAL COMPOSITION, ARTICLE FOR ELECTRONIC USE AND USAGE OF ELECTRONIC MATERIAL COMPOSITION
Document Type and Number:
Japanese Patent JP3855220
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject composition, capable of exhibiting specific physical properties after curing, having a strength and capable of improving the yield even by miniaturization and further providing molded products having resistance to a sudden temperature change by including a curable polymer.
SOLUTION: This composition for an electronic material comprises at least a curable polymer and has at least (A) temperature characteristics of rigidity in which the glass transition temperature in a process for transfer from a glassy state into a rubbery state is -50 to +50°C in a change of the rigidity for temperature and (B) 105 to 107 Pa rigidity in the rubbery state as physical properties after curing. Furthermore, the composition preferably has (C) an extensibility without breaking with 5% shear strain at -50°C as the physical properties. The curable polymer used is preferably a curable polymer containing a polysulfide-based polymer. A powder of the electronic material can further be added to the composition to provide a composition having the above physical properties.
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Inventors:
Hideki Ogawa
Kinya Iri
Mitsuyoshi Ito
Kinya Iri
Mitsuyoshi Ito
Application Number:
JP18466999A
Publication Date:
December 06, 2006
Filing Date:
June 30, 1999
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
C08L81/04; H05K9/00; C08K3/04; C08K3/08; C08K3/20; C08L63/00; C08L101/00; C08L101/16; (IPC1-7): C08L101/16; C08K3/04; C08K3/08; C08K3/20; C08L81/04; H05K9/00
Domestic Patent References:
| JP57185317A | ||||
| JP11106731A | ||||
| JP2175749A |
Attorney, Agent or Firm:
Tadashi Sano
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