Title:
ELECTRONIC PART AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3459018
Kind Code:
B2
Abstract:
PURPOSE: To provide an electronic part which is possessed of an insulating protective film of polyimide or the like used for protecting a pattern or the like formed art a board which is free from breaking, cracking, and chipping.
CONSTITUTION: The corners 5 and ridges 6 of a board 4 are smoothly polished through a barrel polishing process or a blast process, a part of the surface of the board 4 is partially coated with an insulating resin 3 of polyimide or the like, and an outer electrode is formed for the formation of an electronic part after conductive adhesive agent is applied onto an outer electrode forming spot on the board 4 or after the residue of insulating resin of polyimide or the like is removed through a blast process.
Inventors:
Takuguchi Haruhisa
Application Number:
JP35378493A
Publication Date:
October 20, 2003
Filing Date:
December 28, 1993
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B24C3/32; H01C1/034; H01C1/14; H01F17/00; H01F27/29; H01F41/04; H01L21/301; H01L21/304; H01L21/60; H05K3/28; (IPC1-7): H01F17/00; B24C3/32; H01C1/034; H01C1/14; H01F27/29; H01F41/04; H05K3/28
Domestic Patent References:
| JP254903A | ||||
| JP2155205A | ||||
| JP5144666A | ||||
| JP5283272A | ||||
| JP55113559A | ||||
| JP5205944A | ||||
| JP521404U | ||||
| JP217829U |
Attorney, Agent or Firm:
Akira Wada
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