Title:
ELECTRONIC PART, ITS MANUFACTURING METHOD, AND WIRELESS TERMINAL
Document Type and Number:
Japanese Patent JP3283838
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To increase the yield in manufacturing or prevent the element rising phenomenon.
SOLUTION: In an electronic component, a conductive film 12 is formed on a base 11, and a groove is formed at a side face of the base 11. A protective material 14 for covering the groove 13 is formed, and terminal parts 15 and 16 are formed at both ends of the base 11. The film thickness of the terminal parts 15 and 16 is made thicker than that of the conductive film 12, and preferably, the film thickness of the terminal parts 15 and 16 is made 1.5 to 7 times the film thickness of the conductive film 12.
Inventors:
Kiyosue Kuniaki
Masanobu Kuroki
Hiromi Sakita
Kenzo Isozaki
Masanobu Kuroki
Hiromi Sakita
Kenzo Isozaki
Application Number:
JP36709198A
Publication Date:
May 20, 2002
Filing Date:
December 24, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01F17/00; H01F27/29; (IPC1-7): H01F17/00; H01F27/29
Domestic Patent References:
| JP11144959A | ||||
| JP7307201A | ||||
| JP7122446A | ||||
| JP888123A | ||||
| JP9186037A | ||||
| JP5267025A | ||||
| JP58155823U |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)