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Title:
ELECTRONIC PART MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2002176292
Kind Code:
A
Abstract:

To provide an electronic part attaching device wherein attaching error of an electronic part to an electronic circuit board is checked for correcting attitude and height, resulting in improved mounting quality and productivity.

A distance sensor 10 is used to measure the height and position where an electronic part 16 is mounted for detecting the height and tilt of the mounting position. The position is corrected according to the height and tilt of the position for improved mounting quality. The distance sensor 10 is also used to acquired the upper surface height of the electronic part 16 before and after mounting it, or a difference in height between the upper surface of an electronic circuit board 17 and the upper surface of the electronic part 16 for detecting tilt/rising of the attitude. If the tilting is detected, the upper surface of the electronic part 16 is pressed with a pressing means to correct tilted attitude for improved mounting quality and productivity.


Inventors:
USUI HIROAKI
MATSUTANI KAZUHIRO
Application Number:
JP2000370294A
Publication Date:
June 21, 2002
Filing Date:
December 05, 2000
Export Citation:
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Assignee:
JUKI KK
International Classes:
H05K13/04; H05K13/08; (IPC1-7): H05K13/04; H05K13/08
Domestic Patent References:
JPH07249895A1995-09-26
JPH10253323A1998-09-25
JP2000133995A2000-05-12
JPH04219943A1992-08-11
JPH0851297A1996-02-20
JPH08255995A1996-10-01
Attorney, Agent or Firm:
Hiroshi Arafune (1 person outside)