Title:
ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPH0218954
Kind Code:
A
Abstract:
PURPOSE: To seek to improve moisture resistance in electronic parts sealed with thermoplastic resin by forming synthetic resin in a projecting shape at a part of lead comb.
CONSTITUTION: In electronic parts consisting of lead comb 4, an element 2, and synthetic resin, a projection 3 is made of synthetic resin at a part of the lead comb and is sealed. By formation of this resin projection 3, the cooling speed of the resin at the peripheral part of the lead comb can be equalized, so crack generation arising from stress concentration can be prevented. Hereby, the moisture resistance can be improved.
Inventors:
FUNAKOSHI YASUTOMO
SHINKAWA TOMOHIKO
MATSUI ATSUSHI
SHINKAWA TOMOHIKO
MATSUI ATSUSHI
Application Number:
JP16944188A
Publication Date:
January 23, 1990
Filing Date:
July 07, 1988
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01C1/14; H01G2/10; H01G4/224; H01G4/228; H01G13/00; H01L23/28; H01L23/50; (IPC1-7): H01C1/14; H01G1/02; H01G1/14; H01G13/00; H01L23/28; H01L23/50
Attorney, Agent or Firm:
Shigetaka Awano (1 person outside)
Next Patent: JPH0218955