Title:
電子機器及び冷却モジュール
Document Type and Number:
Japanese Patent JP7273116
Kind Code:
B2
Abstract:
An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.
Inventors:
Masahiro Kitamura
Yusuke Onoe
Takuro Uemura
Akinori Uchino
Yusuke Onoe
Takuro Uemura
Akinori Uchino
Application Number:
JP2021139056A
Publication Date:
May 12, 2023
Filing Date:
August 27, 2021
Export Citation:
Assignee:
Lenovo Singapore Private Limited
International Classes:
G06F1/20; F28D15/02; G06F1/16; H01L23/427; H01L23/467; H05K7/20
Domestic Patent References:
| JP2019056511A | ||||
| JP2019165167A | ||||
| JP2018186272A | ||||
| JP2021012590A |
Attorney, Agent or Firm:
Sakai International Patent Office