Title:
電子機器
Document Type and Number:
Japanese Patent JP6780422
Kind Code:
B2
Abstract:
An electronic device including multiple circuit boards facing in a casing is not upsized for a relatively-tall electronic component mounted on a circuit board. An electronic device (1) includes a first circuit board (20) and a second circuit board (60) arranged to have their first main surfaces (20a, 60a) facing each other, and a casing (2) containing the first and second circuit boards (20, 60). The first circuit board (20) has the first main surface (20a) having a first electronic component (EC1) with a mounting height (H1) from the first main surface (20a) toward the second circuit board (60) greater than a distance (L) between the first and second circuit boards (20, 60). The second circuit board (60) has an opening or a cutout as a first hollow portion (61) facing the first electronic component (EC1). The first hollow portion (61) receives a part of the first electronic component (EC1).
Inventors:
Hiroaki Ueda
Application Number:
JP2016194280A
Publication Date:
November 04, 2020
Filing Date:
September 30, 2016
Export Citation:
Assignee:
OMRON Corporation
International Classes:
H05K1/14; H05K1/02; H05K5/00; H05K5/02; H05K5/03; H05K7/14
Domestic Patent References:
| JP62128691U | ||||
| JP2002305383A | ||||
| JP60078190U |
Attorney, Agent or Firm:
Fukami patent office