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Title:
電子機器
Document Type and Number:
Japanese Patent JP7275380
Kind Code:
B2
Abstract:
Not only cooling performance for an integrated circuit such as a CPU but also cooling performance for a power supply unit is improved. An electronic apparatus (1) includes a first heat sink (71) and a power supply unit (60) including a power supply unit case (61) having an intake air wall (61a) in which a plurality of air intake holes (61b) are formed. The intake air wall (61b) is located in front of the first heat sink (71). The intake air wall (61b) has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink (71). A cooling fan (5) is disposed to feed air toward the intake air wall (61a).

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Inventors:
Shinya Tsuchida
Keiichi Aoki
Yasuhiro Otori
Yuta Tamaki
Masaharu Morishita
Application Number:
JP2022509223A
Publication Date:
May 17, 2023
Filing Date:
September 24, 2020
Export Citation:
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Assignee:
Sony Interactive Entertainment Inc.
International Classes:
H05K7/20
Domestic Patent References:
JP2011198860A
JP11119181A
Attorney, Agent or Firm:
Patent Attorney Corporation Haruka International Patent Office



 
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