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Title:
ELECTROPLATED BAND SAW AND MANUFACTURING METHOD FOR IT
Document Type and Number:
Japanese Patent JP2002018639
Kind Code:
A
Abstract:

To provide an electroplated band saw and a manufacturing method for it, having the low side surface resistance in cutting, good linearly moving performance and good sharpness, excellent in cutting precision, and capable of lengthening the life.

This band saw is formed by forming a super abrasive grain layer on an action part by electrodeposition along one side edge of a base metal formed of a flat plate-shaped metallic belt. A method is provided for manufacturing an electro plated band saw formed by providing a back taper on the super abrasive grain layer, and the electro plated band saw formed by providing the taper back along one side edge part of the base metal by machining both side surfaces of the action part and then forming the super abrasive grain layer on it by electrodeposition, or forming the super abrasive grain layer by electrodepositing after previously applying the surface treatment of plating of a back taper shape to the action part along one side edge of the base metal.


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Inventors:
MURATA YASUNORI
TAKANO SEIJU
Application Number:
JP2000195541A
Publication Date:
January 22, 2002
Filing Date:
June 29, 2000
Export Citation:
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Assignee:
ASAHI DIAMOND IND
International Classes:
B23D61/12; B23D61/18; B28D5/04; C25D15/02; (IPC1-7): B23D61/12; B23D61/18; C25D15/02
Attorney, Agent or Firm:
Uchiyama Mitsuru