Title:
ELECTROPLATING METHOD, ELECTROPLATING DEVICE AND ELECTROPLATING RACK
Document Type and Number:
Japanese Patent JP3411103
Kind Code:
B2
Abstract:
PURPOSE: To provide an electroplating method capable of surely forming an electroplating film in the hole of a material to be plated while avoiding the early deterioration, complication and enlargement of the device.
CONSTITUTION: A printed circuit board 1 aa a material to be plated having a hole 2 is fixed on the cathode side of the electroplating tank 4 filled with an electroplating soln. First and second electroplating soln. feed pipes 14 and 15 are arranged on both sides of the printed board 1. The flow velocity of the electroplating soln. is periodically changed so that the flow velocity of electroplating soln. supplied from the feeder pipes 14 and 15 is alternately and relatively increased. Consequently, the electroplating soln. is surely supplied into the hole of the board 1, namely, the through-hole forming hole 2, and the throwing power on the part is improved.
Inventors:
Manabu Okumura
Application Number:
JP22066794A
Publication Date:
May 26, 2003
Filing Date:
September 14, 1994
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
C25D5/08; C25D7/00; C25D17/08; C25D21/10; H05K3/42; (IPC1-7): C25D5/08; C25D7/00; C25D17/08; C25D21/10
Domestic Patent References:
| JP60177195A | ||||
| JP5867896A | ||||
| JP53119225A | ||||
| JP6280084A | ||||
| JP4325696A | ||||
| JP61180164U | ||||
| JP57200563U | ||||
| JP5265869U |
Attorney, Agent or Firm:
Hironobu Onda
Previous Patent: MULTILAYERED STRUCTURAL MEMBER OF FLUORINATED AND NON-FLUORINATED THERMOPLASTIC RESINS
Next Patent: RECORDING MEDIUM TRANSPORT DEVICE
Next Patent: RECORDING MEDIUM TRANSPORT DEVICE