電解めっき方法

Title:

電解めっき方法

Document Type and Number:

Japanese Patent JP4139312

Kind Code:

B2

Abstract:

To provide an electroplating method for forming a uniform plating film by taking fine particles insoluble in water into precipitated metal.

A fine particle dispersing agent containing at least a glycine based amphoteric surfactant and benzyl ammonium chloride based cationic surfactant in such a manner that the content ratio of alkyldi(aminoethyl)glycine as the amphoteric surfactant to dimethylbenzylalkylammonium chloride as the cationic surfactant is controlled to the range of 3 to 5,000 to 500:1 is added to an electroplating bath in such a manner that the concentration of the alkyldi(aminoethyl)glycine as the amphoteric surfactant is controlled to the range of 0.0015 to 1.5 g/L, and also, the concentration of the dimethylbenzylalkylammonium chloride as the cationic surfactant is controlled to the range of 0.003 to 2.5 g/L. Further, fine particles insoluble in water are charged therein, and electroplating is performed using the electroplating bath.

Inventors:

Akira Toda
Seiichi Kiuchi
Naoto Hashimoto

Application Number:

JP2003360607A

Publication Date:

August 27, 2008

Filing Date:

October 21, 2003

Export Citation:

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