Title:
ELEMENT, SEMICONDUCTOR DEVICE, LIGHT-EMITTING DEVICE, DISPLAY DEVICE, METHOD FOR SEPARATION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2018173542
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an element, a semiconductor device, a display device, and a light-emitting device which have a smaller thickness and a smaller weight, to provide an element, a semiconductor device, a display device, and a light-emitting device which are not easily broken, or to provide an element, a semiconductor device, a display device, and a light-emitting device which are flexible.SOLUTION: The element includes: a substrate; a first resin layer in contact with the substrate; a second resin layer in contact with the first resin layer; and a first layer in contact with the second resin layer, the second resin layer being mainly made of polyimide resin. In the element, a material is detected that has a mass-to-charge ratio from 300 to 950, both inclusive, determined by an LC/MS (liquid chromatography mass analysis) measurement in the interface between the first and second resin layers. There are also provided a semiconductor device, a display device, and a light-emitting device which have the element.SELECTED DRAWING: Figure 1
Inventors:
KAWAKAMI SACHIKO
SEO TETSUSHI
KAMISAKA AYAKA
SEO TETSUSHI
KAMISAKA AYAKA
Application Number:
JP2017071623A
Publication Date:
November 08, 2018
Filing Date:
March 31, 2017
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB CO LTD
International Classes:
G09F9/30; B32B27/00; G02F1/1333; G09F9/00; H01L21/02; H01L21/336; H01L27/32; H01L29/786; H01L51/50; H05B33/02; H05B33/10; H05B33/14
Domestic Patent References:
| JP2012113212A | 2012-06-14 |
Foreign References:
| WO2015008642A1 | 2015-01-22 | |||
| US20140368775A1 | 2014-12-18 |