Title:
EMC COUNTERMEASURE STRUCTURE OF ELECTRONIC CIRCUIT UNIT
Document Type and Number:
Japanese Patent JP3299108
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a front panel and grounded structure of an electronic circuit package having a superior operability of inserting and removing the package and superior electromagnetic shield effect at the front of an electronic circuit unit.
SOLUTION: A U-shaped connection board 3 is disposed on the front face of an electronic circuit package, connection contacts fixed to the side face of the board 3, the end face of the board 3 facing at the adjacent electronic circuit package is chamfered, a stepped shield board 7 is bonded to the connection board 3 so as to locate at the back of an ejector, a rotary support point 9 is formed on the front of a base plate 12 of an electronic circuit unit 10 and a rotary connection board 8 contacted to the contacts 4 is mounted on the rotary support point.
Inventors:
Koji Tayama
Yoshitaro Sato
Toru Kishimoto
Hironori Oka
Mitsuhiko Kawauchi
Yoshitaro Sato
Toru Kishimoto
Hironori Oka
Mitsuhiko Kawauchi
Application Number:
JP7838196A
Publication Date:
July 08, 2002
Filing Date:
March 06, 1996
Export Citation:
Assignee:
NEC
Nippon Telegraph and Telephone Corporation
Nippon Telegraph and Telephone Corporation
International Classes:
H05K9/00; H05K7/14; (IPC1-7): H05K7/14; H05K9/00
Domestic Patent References:
| JP738272A | ||||
| JP563386A | ||||
| JP6413798A | ||||
| JP5183287A | ||||
| JP559898U | ||||
| JP2122493U | ||||
| JP63164290U |
Attorney, Agent or Firm:
Asamichi Kato
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