Title:
電気デバイス用のシールハウジングおよびシールハウジングを使用する封止型リレー
Document Type and Number:
Japanese Patent JP7118837
Kind Code:
B2
Abstract:
The present invention relates to a seal housing for an electrical device, such as an electromagnetic relay, and a sealed relay using the seal housing. A seal housing comprises a base, a cover adapted to cover an inwardly facing side of the base, thereby forming a housing for accommodating components of the electrical device, and a sealing plate adapted to partially cover an outwardly facing side of the base and protect the base from fluid condensate. The sealing plate has an outward side with a profile that is shaped to divert fluid or fluid condensate formed at the outward side of the sealing plate, so that device failure due to short-circuits between terminals protruding from the base can be prevented. The intersection regions between the base, the cover and/or the electrical terminals are sealed by applying a sealing compound over discrete regions along the intersections regions that are not covered by the sealing plate, thereby reducing the amount of sealing compound required.
Inventors:
Sandoval, Lewis
Real, Nuno
Real, Nuno
Application Number:
JP2018179583A
Publication Date:
August 16, 2022
Filing Date:
September 26, 2018
Export Citation:
Assignee:
Tyco Electronics Components Electromechanicos Elyder
International Classes:
H01H45/02
Domestic Patent References:
| JP2139821A | ||||
| JP7041941U | ||||
| JP54137746U |
Attorney, Agent or Firm:
Oba Mitsuru
Miyuki Horikawa
Yukako Otake
Seiko Yamashita
Madoka Sasaki
Miyuki Horikawa
Yukako Otake
Seiko Yamashita
Madoka Sasaki