Title:
封止フィルム
Document Type and Number:
Japanese Patent JP6580592
Kind Code:
B2
Abstract:
Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. Particularly, the encapsulation film, which effectively blocks moisture or oxygen entering the organic electronic device from the outside, and has excellent mechanical properties such as handleability and processability, and the organic electronic device including the same are provided.
Inventors:
Hyun Suk Kim
Hyun Ji Yu
Jun Ok Moon
Se U Yang
Hyun Ji Yu
Jun Ok Moon
Se U Yang
Application Number:
JP2016563443A
Publication Date:
September 25, 2019
Filing Date:
February 17, 2016
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H05B33/04; B32B9/00; H01L51/50; H05B33/10
Domestic Patent References:
| JP2009221515A | ||||
| JP2015502868A | ||||
| JP2013121723A | ||||
| JP2010181749A |
Foreign References:
| WO2011027815A1 | ||||
| WO2014189292A1 |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe