Title:
封止用樹脂組成物、電子部品の製造方法、電子部品
Document Type and Number:
Japanese Patent JP5282726
Kind Code:
B2
Inventors:
Kuniyuki Nitta
Application Number:
JP2009280497A
Publication Date:
September 04, 2013
Filing Date:
December 10, 2009
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C08L101/00; C08K3/36; C08K9/06; H01L23/29; H01L23/31
Domestic Patent References:
| JP2010211968A | ||||
| JP6256639A | ||||
| JP2003160641A |
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