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Title:
光半導体用封止シート
Document Type and Number:
Japanese Patent JP5511524
Kind Code:
B2
Abstract:
The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.

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Inventors:
Hirokazu Matsuda
Ichiro Suehiro
Application Number:
JP2010129817A
Publication Date:
June 04, 2014
Filing Date:
June 07, 2010
Export Citation:
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Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L23/29; H01L21/56; H01L23/31; H01L33/54
Domestic Patent References:
JP2010123802A
Attorney, Agent or Firm:
Yoshinori Hosoda



 
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