Title:
ENVELOPE FOR LIGHT-EMITTING ELEMENT
Document Type and Number:
Japanese Patent JP2006165097
Kind Code:
A
Abstract:
To improve heat dissipation efficiency in an envelope of a light-emitting element.
An electrode of the bottom surface of a light-emitting element 1a is connected to a lead frame 11, and an electrode of the bottom surface of a light-emitting element 1a' is connected to another lead frame 12. With this configuration, since the heat generated in the light-emitting element 1a is dissipated through the lead frame 11, and the heat generated in the light-emitting element 1a' is dissipated through the lead frame 12, the heat dissipation efficiency is improved.
Inventors:
KINOSHITA JUNICHI
Application Number:
JP2004351150A
Publication Date:
June 22, 2006
Filing Date:
December 03, 2004
Export Citation:
Assignee:
HARISON TOSHIBA LIGHTING CORP
International Classes:
H01L33/30; H01L33/56; H01L33/60; H01L33/62; H01L33/64
Domestic Patent References:
| JPS6275697A | 1987-04-07 | |||
| JP2003008075A | 2003-01-10 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu